Sealed enclosure for power electronics incorporating a heat exchanger

Patent No. 9,295,185

Issued: March 22, 2016
Filed: March 12, 2014
Term Extension: 126 days

Inventor: Icoz; Tunc (Bridgewater, NJ), Santini; John (Columbia, NJ), Mulcahy; Gary (Flanders, NY), Feely; James (Hackettstown, NJ)
Assignee: Transistor Devices, Inc. (Hackettstown, NJ)


A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration.

Reference to Related Applications

This application claims one or more inventions which were disclosed in Provisional Application No. 61/779,469, filed Mar. 13, 2013, entitled "FUNCTIONAL HEAT EXCHANGER AND SEALED ENCLOSURE FOR POWER ELECTRONICS". The benefit under 35 USC 119(e) of the United States provisional application is hereby claimed, and the aforementioned application is hereby incorporated herein by reference.


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